Cardboard-box-free packaging of solid yeast products
US9828155B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2016 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Oct 7, 2036 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA23V2002/00
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
The invention relates to packaging (10) for solid yeast products, such as: a supporting element (12); solid yeast products contained in one or more packages (22), supported by the supporting element (12); and an outer cover (14) retaining all of the solid yeast products contained in the packages (22) on the supporting element (12). According to the invention, all of the packages (22) located between the solid yeast products and the outer cover (14) may have a surface density no greater than 200 g/m2. The invention also relates to a method for packaging solid yeast products and to a method for preserving and using solid yeast products thus packaged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.