MEMS cavity substrate
US9828238B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 2, 2016 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Jul 21, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2207/012
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
In accordance with an example embodiment of this disclosure, a micro-electro-mechanical system (MEMS) device comprises a substrate, a CMOS die, and a MEMS die, each of which comprises a top side and a bottom side. The bottom side of the CMOS die is coupled to the top side of the substrate, and the MEMS die is coupled to the top side of the CMOS die, and there is a cavity positioned between the CMOS die and the substrate. The cavity may be sealed by a sealing substance, and may be filled with a filler substance (e.g., an adhesive) that is different than the sealing substance (e.g., a gaseous or non-gaseous substance). The cavity may be fully or partially surrounded by one or more downward-protruding portions of the CMOS die and/or one or more upward-protruding portions of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.