Accelerometer and its fabrication technique
US9828242B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2016 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Sep 23, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0118
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An accelerometer includes a measurement mass, a top cap silicon wafer and a bottom cap silicon wafer, both of which are coupled with the measurement mass. The measurement mass includes a support frame, a mass, and a plurality of resilient beams. The mass and the resilient beams are located within the support frame. The mass and the support frame are connected by several sets of the resilient beams, and each set comprises two resilient folding beams. The resilient folding beams are symmetrically provided with respect to the midline of the mass. A connection beam is provided in between each set of the resilient folding beams to connect the resilient folding beams together. Silicon wafers with electrodes are bonded on the top and bottom surfaces of the measurement mass, and form a capacitor with the measurement mass. The accelerometer has a large mode isolation ratio and is symmetrical in high order vibrational modes, which further decreases the noise of a MEMS chip. Therefore, the accelerometer provides the advantages of high measurement accuracy, high stability, and low noise.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.