Compound containing phenolic hydroxy group, photosensitive composition, composition for resists, resist coating film, curable composition, composition for resist underlayer films, and resist underlayer film
US9828457B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2014 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Jun 12, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07C2603/92
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided is a compound containing a phenolic hydroxy group which has excellent heat resistance, a resist composition which has excellent thermal decomposition resistance, optical sensitivity and resolution, and a composition for a resist underlayer coating which has excellent thermal decomposition resistance and dry etching resistance. The compound containing a phenolic hydroxy group has a molecular structure represented by Structural Formula (1) below:wherein R1 is a hydrogen atom, an alkyl group or an aryl group, n is an integer of 2 to 10, R2 is any one of an alkyl group, an alkoxy group, an aryl group, an aralkyl group and a halogen atom, m is an integer of 0 to 4, and when m is 2 or greater, a plurality of R2's may be the same as or different from each other and may be bonded to either one of two aromatic rings of the naphthylene skeleton.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.