Thermally conductive filler and thermally conductive resin composition containing same
US9828538B2 · kind B2 · utility
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3Claims
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Key dates
| Filing date | Sep 10, 2014 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Sep 10, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/014
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermally conductive resin filler including a sintered body containing at least magnesium oxide, calcium oxide, and silicon oxide, the thermally conductive filler being characterized in that, when the molar number of calcium element contained in the total composition of the sintered body in terms of calcium oxide (CaO) is defined as MCa, and the molar number of silicon element contained in the total composition of the sintered body in terms of silicon oxide (SiO2) is defined as MSi, the molar ratio of the calcium oxide (CaO) to the silicon oxide (SiO2) represented by MCa/MSi is in the range of 0.1 or more and less than 2.0.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.