Patent · US Active

Module for a heat pump

US9829225B2 · kind B2 · utility

0Cited by
4References
23Claims
0Family size

Assignees

Inventors

Key dates

Filing dateJul 19, 2012
Grant dateNov 28, 2017
Priority date
Expiry dateJul 13, 2034

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02B30/00
  • WIPO fieldThermal processes and apparatus
  • WIPO sectorMechanical engineering

Abstract

The invention relates to a module for a heat pump, comprising an adsorption-desorption region, wherein in the region a bundle of pipes through which fluid can flow is arranged and a housing encloses the pipe bundle and a movable working medium in a sealing manner, wherein a supporting structure forms a mechanical support of a wall of the housing against the action of an external pressure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.