Module for a heat pump
US9829225B2 · kind B2 · utility
0Cited by
4References
23Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 19, 2012 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Jul 13, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The invention relates to a module for a heat pump, comprising an adsorption-desorption region, wherein in the region a bundle of pipes through which fluid can flow is arranged and a housing encloses the pipe bundle and a movable working medium in a sealing manner, wherein a supporting structure forms a mechanical support of a wall of the housing against the action of an external pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.