Patent · US Active

Microelectromechanical sensor module and corresponding production method

US9829357B2 · kind B2 · utility

0Cited by

0References

10Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Tjalf Pirk · Stuttgart, DE
Thomas Wagner · Kammerstein, DE
Ando Feyh · Palo Alto, US
Georg Bischopink · Neckartenzlingen, DE
Axel Franke · Ditzingen, DE

Key dates

Filing date	Oct 14, 2011
Grant date	Nov 28, 2017
Priority date	—
Expiry date	May 23, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49128
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A microelectromechanical sensor module includes a sensing mechanism for measuring an acceleration, pressure, air humidity or the like, a control mechanism for controlling the sensing mechanism, an energy supply mechanism for supplying the sensor module with energy, and a transmission mechanism for transmitting signals of the sensing mechanism. At least three of the mechanisms are integrated at the chip level in at least one chip in each case. A corresponding method is implemented to produce the microelectromechanical sensor module.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.