Wafer image inspection apparatus
US9829441B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 27, 2014 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Nov 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
ProA wafer image inspection apparatus for inspecting defects of a semiconductor wafer comprises: a lighting portion for generating light; a lens portion for obtaining a wafer image, which is reflected after the light has been reflected onto a wafer to be inspected, and delivering the wafer image by lighting same in one direction; a dividing optical element for dividing the wafer image delivered from the lens portion; an image detection portion comprising a plurality of image-capturing elements, which are installed so that images which have passed through the lens portion and the dividing optical element are respectively formed on different focus positions; and an image processing portion for combining the images on different focus positions captured by the plurality of image pick-up elements to form a TSOM image, and comparing the TSOM image with a TSOM image of a normal semiconductor apparatus part to determine whether an object is defective.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.