Die-cutting approaches for foil-based metallization of solar cells

US9831377B2 · kind B2 · utility

Assignee

• SUNPOWER CORPORATION · US

Inventors

• Richard Hamilton Sewell · Los Altos, US
• Benjamin Ian Hsia · Fremont, US

Key dates

• Filing date: Feb 29, 2016
• Grant date: Nov 28, 2017
• Expiry date: Feb 29, 2036

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50

Abstract

Die-cutting approaches for foil-based metallization of solar cells, and the resulting solar cells are disclosed herein. Die-cutting approaches for foil-based metallization of solar cells include forming a plurality of semiconductor regions in or above a substrate and forming a patterned damage buffer in alignment with locations between the plurality of semiconductor regions. Additionally, a metal layer comprising a metal seed layer and/or metal foil is formed over the patterned damage buffer. The metal layer is cut by a cutting die at locations between the plurality of semiconductor regions by applying a mechanical force to the cutting die.