Optoelectronic semiconductor component

US9831394B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Michael Binder · Brooklyn, US
• Alexander Linkov · Regensburg, DE
• Thomas Zeiler · Nittendorf, DE
• Peter Brick · Regensburg, DE

Key dates

• Filing date: Jul 7, 2015
• Grant date: Nov 28, 2017
• Expiry date: Dec 12, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/882

Abstract

An optoelectronic semiconductor component is provided, having a connection carrier (2), an optoelectronic semiconductor chip (1), which is arranged on a mounting face (22) of the connection carrier (2), and a radiation-transmissive body (3), which surrounds the semiconductor chip (1), wherein the radiation-transmissive body (3) contains a silicone, the radiation-transmissive body (3) has at least one side face (31) which extends at least in places at an angle β of <90° to the mounting face (22) and the side face (3) is produced by a singulation process.