Light emitting diode package
US9831404B2 · kind B2 · utility
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Assignee
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Key dates
| Filing date | Nov 6, 2016 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Nov 6, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
Abstract
A light emitting diode (LED) package includes a light element, a light transferring layer disposed on the light element, a packaging layer enclosing the light transferring layer, a white wall surrounding the packaging layer and a diffusion film disposed on the packaging layer. The light transferring layer has a light outlet face, a light inlet face opposite to the light outlet face and a peripheral side. The light inlet face faces the light element. The white wall surrounds the peripheral side that is enclosed by the packaging layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.