Evaporation system and fabricating method and evaporation method thereof
US9831430B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Apr 14, 2016 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Apr 14, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/164
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An evaporation source is provided. The evaporation source includes a substrate, a plurality of recesses spaced from each other and arranged on the substrate, and a plurality of heating sources arranged within the plurality of recesses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.