Optoelectronic component and method for producing same

US9831465B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Richard Baisl · Regensburg, DE
• Christoph Kefes · Regensburg, DE
• Michael Popp · Birkenfeld, DE

Key dates

• Filing date: Jun 30, 2014
• Grant date: Nov 28, 2017
• Expiry date: Sep 10, 2034

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50

Abstract

A method for producing an optoelectronic component may include forming an optoelectronic layer structure having a first adhesion layer, which comprises a first metallic material, above a carrier, providing a covering body with a second adhesion layer, which comprises a second metallic material, applying a first alloy to one of the two adhesion layers, the melting point of the first alloy being so low that the first alloy is liquid, coupling the covering body to the optoelectronic layer structure in such a way that both adhesion layers are in direct contact with the liquid first alloy, and reacting at least part of the liquid first alloy chemically with the metallic materials, as a result of which at least one second alloy is formed, which has a higher melting point than the first alloy, wherein the second alloy solidifies and fixedly connects the covering body to the optoelectronic layer structure.