Encapsulated semiconductor device and encapsulation method

US9831467B2 · kind B2 · utility

Assignee

• OLEDWORKS GMBH · DE

Inventors

• Jens Meyer · Dresden, DE
• Rainald Manfred Gierth · Aachen, DE
• Stefan Peter Grabowski · Neuss, DE
• Herbert Lifka · Eindhoven, NL
• Peter Van De Weijer · Heeze, NL
• Petrus Cornelis Paulus Bouten · Eindhoven, NL
• Volker Van Elsbergen · Aachen, DE
• Manfred Ruske · Ludwigshafen, DE
• Sören Hartmann · Baesweiler, DE

Key dates

• Filing date: Jan 13, 2015
• Grant date: Nov 28, 2017
• Expiry date: Jan 13, 2035

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/549

Abstract

The present invention relates to an encapsulated semiconductor device (20) provided on a flexible substrate (1), a method of providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1) and a software product for providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1). In a preferred embodiment, an encapsulation method is presented in which the organic layer (3) of an inorganic/organic/inorganic multilayer barrier (5) on a plastic foil (1) as a substrate is removed at the edges of an OLED (13). The edges are subsequently sealed with a standard TFE process to encapsulate the OLED (13). This enables cuttable OLEDs (20) that are cut out of a larger plastic substrate (1) and gives a method to reduce side leakage in OLEDs (20) that have been manufactured in a roll-to-toll process.