Surface acoustic wave element and method of manufacturing the same
US9831849B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 5, 2015 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Feb 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/1071
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a surface acoustic wave element and a method of manufacturing the same, and more specifically, to a surface acoustic wave element and a method of manufacturing the same, the element including a piezoelectric substrate; a plurality of IDT electrodes formed on the piezoelectric substrate; a plurality of resonator electrodes formed on the piezoelectric substrate; a wiring metal layer formed as a wiring area to electrically connect the plurality of IDT electrodes and the plurality of resonator electrodes; and an insulation layer formed on the piezoelectric substrate, the plurality of IDT electrodes, the plurality of resonator electrodes and the wiring metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.