Multilayered substrate and method of manufacturing the same
US9832866B2 · kind B2 · utility
5Cited by
5References
7Claims
0Family size
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Key dates
| Filing date | Jun 29, 2016 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Jun 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/043
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.