Electronic device display vias
US9832868B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2016 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Mar 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device may have layers of glass for forming components such as a display. A display cover glass layer may overlap an array of pixels. A touch sensor may be formed under the display cover glass layer. Conductive structures such as transparent conductive electrodes or other conductive layers of material may be formed on the outer surface of the display cover glass layer. The electrodes on the outer surface of the display cover glass layer may be coupled to metal contacts and other circuitry on the inner surface of the display cover glass layer using conductive vias. Vias may be provided with barrier layers, opaque coatings, tapers, and other structures and may be formed using techniques that enhance compatibility with chemical strengthening processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.