Substrate structures applied in flexible electrical devices and fabrication method thereof
US9833977B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2009 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Apr 19, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24942
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a first material layer overlying the carrier with a first area, a second material layer overlying the first material layer and the carrier with a second area, and a flexible substrate overlying the second material layer, the first material layer and the carrier with a third area, wherein the second area is larger than or equal to the first area, the third area is larger than the second area, and the flexible substrate has a greater adhesion force than that of the first material layer to the carrier. The invention also provides a method for fabricating the substrate structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.