Patent · US Active

Securing mechanism and method for wafer bonder

US9833980B2 · kind B2 · utility

0Cited by

4References

20Claims

0Family size

Assignee

Skyworks Solutions, Inc. · US

Inventors

Steve Canale · Simi Valley, US
David J. Zapp · Simi Valley, US

Key dates

Filing date	Jul 29, 2016
Grant date	Dec 5, 2017
Priority date	—
Expiry date	Jul 29, 2036

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T292/45
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.