Method and system for preparing substrates before gold-plated
US9833984B2 · kind B2 · utility
0Cited by
0References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 10, 2014 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Jul 12, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M7/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention concerns a method and/or a system for personalizing substrates and/or preparing substrates before gold-plating. In particular, the invention consists of a printing method comprising a step in which the substrate is subjected to inkjet printing followed by a gold-plating step in which the regions of the substrate to be gold-plated are brought into contact with the gold-plating leaf, characterized by an additional step performed prior to the gold-plating step and which consists in the preparation of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.