Patent · US Active

Evaporative heat transfer system

US9835363B2 · kind B2 · utility

7Cited by
6References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 10, 2014
Grant dateDec 5, 2017
Priority date
Expiry dateNov 12, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Evaporative heat transfer system. The system includes a substrate and a plurality of substantially parallel, spaced-apart ridges extending from the substrate forming vertical liquid manifolds therebetween. A nanoporous membrane is supported on the ridges and a pump delivers a dielectric fluid across the ridges. The fluid is drawn through the liquid manifolds via capillarity provided by the nanoporous membrane and evaporates to dissipate heat flux through the substrate. A preferred dielectric fluid is pentane. It is preferred that membrane porosity vary across the membrane to tailor thermal resistances to limit temperature rises.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.