Planar heat pipe with architected core and vapor tolerant arterial wick
US9835383B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2014 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Jan 20, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/046
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A planar heat pipe for transferring heat between a higher temperature region and a lower temperature region includes a bottom facesheet, a top facesheet, a vapor-venting arterial wick between the bottom facesheet and the top facesheet and including a high permeability layer and a high capillary pressure layer each having pores such that an average pore hydraulic diameter in the high permeability layer is greater than an average pore diameter in the high capillary pressure layer. The pipe also includes an architected mechanical core structure between the arterial wick and the top facesheet, and a working fluid between the bottom facesheet and the top facesheet. The architected mechanical core structure may have a vapor region, and the vapor-venting arterial wick may have a liquid region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.