Electronic component cooling system
US9836102B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 2, 2016 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Aug 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments herein describe a cooling system for a plurality of arrayed components arranged in a first bank and a second bank, the first bank being disposed upstream of the second bank along an airflow path. The system comprises a first wall configured to be positioned above the first bank and the second bank. The first wall defines an angled cavity such that a height of the angled cavity decreases from the front end of the angled cavity to a region between the front end and the back end of the angled cavity. The first wall defines the angled cavity such that a distance between the first wall and the first bank is greater than a distance between the first wall and the second bank. The first wall forms a top portion of the airflow path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.