Semiconductor power package and method of manufacturing the same

US9837288B2 · kind B2 · utility

Assignee

• Infineon Technologies Austria AG · AT

Inventors

• Thomas Basler · Riemerling, DE
• Edward Fuergut · Nuremberg, DE
• Christian Kasztelan · Munich, DE
• Ralf Otremba · Kaufbeuren, DE

Key dates

• Filing date: Jun 1, 2016
• Grant date: Dec 5, 2017
• Expiry date: Jun 1, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor power package includes a pre-molded chip housing and an electrically conducting chip carrier cast-in-place in the pre-molded chip housing. The semiconductor power package further includes a power semiconductor chip bonded on the electrically conducting chip carrier. A covering material is provided to embed the power semiconductor chip. The covering material has an elastic modulus less than an elastic modulus of a material of the pre-molded chip housing and/or a thermal conductivity greater than a thermal conductivity of the material of the pre-molded chip housing and/or a temperature stability greater than a temperature stability of the pre-molded chip housing.