Conductive structure and manufacturing method thereof, array substrate, display device
US9837502B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Aug 24, 2015 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Aug 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/131
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A conductive structure and a manufacturing method thereof, an array substrate and a display device. The conductive structure includes a plurality of first metal layers made of aluminum, and between every two first metal layers that are adjacent, there is also provided a second metal layer, which is made of a metal other than aluminum. With the conductive structure, the hillock phenomenon that happens to the conductive structure when it is heated can be decreased without reducing the overall thickness of the conductive structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.