Soldering system
US9837559B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2013 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Mar 13, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This disclosure relates to a soldering system containing a soldering apparatus and a heating apparatus. The soldering apparatus includes a heating plate having a body defining a plurality of first air exits, each first air exit extending through the body of the heating plate and the heating plate being configured to supply hot air through the first air exits; a cover disposed on the heating plate, the cover and the heating plate defining a hot air chamber; a plurality of axially movable positioning shafts extending though the body of the heating plate, in which each shaft has a first end and a second end, the first end is in the hot air chamber, and the second end is outside the hot air chamber; and a conduit attached to the cover, the conduit being configured to supply hot air to the hot air chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.