Semiconductor package assembly with thermal recycling function
US9837595B2 · kind B2 · utility
7Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2015 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Sep 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a portable electronic system. The portable electronic system includes a semiconductor package. The semiconductor package includes a substrate. A semiconductor die is coupled to the substrate. A thermoelectric device chip is disposed close to the semiconductor die, coupled to the substrate. The thermoelectric device chip is configured to detect a heat energy generated from the semiconductor die and to convert the heat energy into a recycled electrical energy. A power system is coupled to the semiconductor package, configured to store the recycled electrical energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.