Methods and systems for high bandwidth chip-to-chip communcations interface
US9838017B2 · kind B2 · utility
3Cited by
270References
20Claims
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Key dates
| Filing date | Jun 7, 2016 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Jun 7, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Systems and methods are described for transmitting data over physical channels to provide a high bandwidth, low latency interface between integrated circuit chips with low power utilization. Communication is performed using group signaling over multiple wires using a vector signaling code, where each wire carries a low-swing signal that may take on more than two signal values.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.