Semiconductor apparatus, solid-state image sensing apparatus, and camera system
US9838626B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2017 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Jun 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/804
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.