Thermal ducting system
US9839155B2 · kind B2 · utility
3Cited by
120References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2013 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Dec 4, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal ducting system for electronic equipment in an electronic equipment enclosure is provided. The thermal ducting system includes a top duct, a bottom duct spaced apart from the top duct, a side duct extending from the top duct to the bottom duct and along an intake side of the electronic equipment, and at least one baffle positioned in the side duct.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.