Vapor cycle convective cooling of electronics
US9839158B2 · kind B2 · utility
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4References
9Claims
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Assignee
Inventor
Key dates
| Filing date | Mar 13, 2012 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Dec 17, 2032 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B39/04
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A cold plate device and method for cooling electronic systems is provided including a generally flat thermally conductive body having a cooling channel within the thermally conductive body. A first cooling fluid travels through the cooling channel to remove heat from the conductive body. A vapor compression cycle system is coupled to the thermally conductive body such that the first cooling fluid removes heat from a second cooling fluid in a portion of the vapor compression cycle system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.