Metallic nanoparticle dispersion
US9839961B2 · kind B2 · utility
1Cited by
4References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 2, 2014 |
| Grant date | Dec 12, 2017 |
| Priority date | — |
| Expiry date | Jul 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A metallic nanoparticle dispersion includes metallic nanoparticles and a compound according to Formula I,wherein X represents the necessary atoms to form a substituted or unsubstituted ring. The presence of small amounts of the compound according to Formula I increases the conductivity of metallic layers or patterns formed from the metallic nanoparticle dispersions at moderate curing conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.