Patent · US Active

Metallic nanoparticle dispersion

US9839961B2 · kind B2 · utility

1Cited by
4References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 2, 2014
Grant dateDec 12, 2017
Priority date
Expiry dateJul 2, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/122
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

A metallic nanoparticle dispersion includes metallic nanoparticles and a compound according to Formula I,wherein X represents the necessary atoms to form a substituted or unsubstituted ring. The presence of small amounts of the compound according to Formula I increases the conductivity of metallic layers or patterns formed from the metallic nanoparticle dispersions at moderate curing conditions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.