Crash-durable adhesive with enhanced stress durability
US9840070B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2013 |
| Grant date | Dec 12, 2017 |
| Priority date | — |
| Expiry date | Mar 22, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2605/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl-or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin. The structural adhesive develops excellent bonding properties when cured at moderate temperatures, especially from 120 to 170° C., and in addition performs very well in environmental aging stress testing. The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.