Thermoplastic resin composition and molded article using the same
US9840610B2 · kind B2 · utility
1Cited by
22References
9Claims
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Key dates
| Filing date | Sep 23, 2015 |
| Grant date | Dec 12, 2017 |
| Priority date | — |
| Expiry date | Sep 23, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/013
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic resin composition includes (A) a polyester resin, (B) inorganic fillers, and (C) a white pigment, wherein at least one of the (B) inorganic fillers and the (C) white pigment is subjected to surface treatment with a silicone compound, and silicon is present in an amount of about 0.3 wt % to about 2 wt % based on the total weight of (A), (B), and (C).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.