Patent · US Active

Optoelectronic component comprising a bonding layer and method for producing a bonding layer in an optoelectronic component

US9840647B2 · kind B2 · utility

0Cited by

2References

9Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Sven Pihale · Ellingen, DE
Florian Eder · Erlangen, DE

Key dates

Filing date	Nov 5, 2014
Grant date	Dec 12, 2017
Priority date	—
Expiry date	Nov 5, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/0362
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

An optoelectronic component and a method for manufacturing an optoelectronic component are provided. In an embodiment, the optoelectronic component includes a layer sequence having an active layer configured to emit electromagnetic primary radiation, a converter lamina disposed in a beam path of the electromagnetic primary radiation and a bonding layer disposed between the layer sequence and the converter lamina, wherein the bonding layer comprises an inorganic-organic hybrid material having Si—O—Al bonds and/or Si—O—Zr bonds.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.