LED grid device and a method of manufacturing a LED grid device
US9841170B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2013 |
| Grant date | Dec 12, 2017 |
| Priority date | — |
| Expiry date | Apr 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A LED grid device comprising a LED grid and a plate-shaped member at which the LED grid has been arranged. The LED grid has several electrically conducting wires arranged side by side, and several LED modules, each LED module having a LED package, wherein each LED package is coupled to at least two wires of the electrically conducting wires. Each LED module further has a thermally conducting element positioned between two adjacent wires of the wires that the LED package is coupled to. The thermally conducting element carries the LED package, and protrudes from the LED package, and the thermally conducting element is attached to the plate-shaped member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.