Substrate treatment process

US9841235B2 · kind B2 · utility

Assignee

• VON ARDENNE GMBH · DE

Inventors

• Steffen Mosshammer · Rabenau, DE
• Thomas Meyer · Dresden, DE
• Michael W. Brandt · Dallas, US

Key dates

• Filing date: Jul 29, 2014
• Grant date: Dec 12, 2017
• Expiry date: Jan 7, 2035

Classification

• Technology area (CPC F): Mechanical Engineering; Lighting; Heating
• CPC primary: F27B9/40
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

In a substrate treatment process, substrates are moved by a transporting device in a transporting direction through a substrate treatment installation having a number of chambers. The substrates are moved by transporting sections of the transporting device driven independently of one another. The transporting sections are driven such that, if substrates dwell temporarily in the transporting section, they are moved back and forth. Stresses in a substrate brought about by differing inputs of heat as a result of both process-induced and malfunction-induced dwell times of the substrate in a chamber are reduced by compensating within the chamber for a structurally brought about input of heat into the substrate, varying periodically over the length of the chamber, during temporary dwelling of the substrate in the chamber by moving the substrate back and forth over at least one period of the heat input by a change of the transporting direction.