Film thickness measuring device and film thickness measuring method
US9841272B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2015 |
| Grant date | Dec 12, 2017 |
| Priority date | — |
| Expiry date | Nov 27, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/0641
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A film thickness measuring device including: a terahertz wave generator; a prism that has an entrance surface, an abutment surface capable of abutting a surface of a sample including a first film on a side where the first film is formed, and an emission surface; a terahertz wave detector that detects an S-polarization component and a P-polarization component of a reflected wave from the sample, emitted from the emission surface of the prism; and a control section configured to determine a thickness of the first film formed in the sample, based on a difference between a time waveform of the S-polarization component of the reflected wave and a time waveform of the P-polarization component of the reflected wave.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.