Patent · US Active

Method of forming a feature of a target material on a substrate

US9842734B2 · kind B2 · utility

0Cited by

0References

19Claims

0Family size

Assignees

IMEC VZW · BE
Katholieke Universiteit Leuven, KU LEUVEN R&D · BE

Inventors

Annelies Delabie · Leuven, BE
Markus Heyne · Leuven, BE

Key dates

Filing date	Dec 14, 2016
Grant date	Dec 12, 2017
Priority date	—
Expiry date	Dec 14, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/02658
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method is provided for forming a feature of a target material on a substrate. The method including:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.