Intermediate structure for transfer, method for preparing micro-device for transfer, and method for processing array of semiconductor device
US9842782B2 · kind B2 · utility
6Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2016 |
| Grant date | Dec 12, 2017 |
| Priority date | — |
| Expiry date | Mar 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/0753
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for preparing a plurality of micro-devices for transfer includes temporarily bonding the micro-devices onto a carrier substrate; testing the micro-devices on the carrier substrate to determine if there is at least one first failed micro-device in the micro-devices; and removing the first failed micro-device from the carrier substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.