Self-destructing chip

US9842812B2 · kind B2 · utility

Assignee

• HONEYWELL INTERNATIONAL INC. · US

Inventors

• Steven Tin · Edina, US
• Jeffrey James Kriz · Eden Prairie, US
• Steven J. Eickhoff · Brooklyn Park, US
• Jeff A. Ridley · Shorewood, US
• Amit Lal · Ithaca, US
• Christopher Ober · Ithaca, US
• Serhan Ardanuc · Ithaca, US
• Ved Gund · Ithaca, US
• Alex Ruyack · Ithaca, US
• Katherine Camera · Ithaca, US

Key dates

• Filing date: Mar 17, 2015
• Grant date: Dec 12, 2017
• Expiry date: Nov 19, 2035

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E60/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments herein provide for a self-destructing chip including at least a first die and a second die. The first die includes an electronic circuit, and the second die is composed of one or more polymers that disintegrates at a first temperature. The second die defines a plurality of chambers, wherein a first subset of the chambers contain a material that reacts with oxygen in an exothermic manner. A second subset of the chambers contain an etchant to etch materials of the first die. In response to a trigger event, the electronic circuit is configured to expose the material in the first subset of chambers to oxygen in order to heat the second die to at least the first temperature, and is configured to release the etchant from the second subset of the chambers to etch the first die.