Three-dimensional microstructures
US9843084B2 · kind B2 · utility
3Cited by
52References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2016 |
| Grant date | Dec 12, 2017 |
| Priority date | — |
| Expiry date | Jul 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/183
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.