Tag mounted distributed headset with electronics module
US9843660B2 · kind B2 · utility
4Cited by
241References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2015 |
| Grant date | Dec 12, 2017 |
| Priority date | — |
| Expiry date | Jan 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M2250/74
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A device has a communication link, a headset, and an electronics module. The headset is connected to the communication link and has a speaker, and a microphone. The electronics module is connected to the communication link and has a housing with an information conveying tag positioned on a surface, a processor communicatively coupled to the headset through the communication link, a battery, and a wireless transceiver communicatively coupled with a remote terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.