Modular mold system
US9844902B2 · kind B2 · utility
1Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2015 |
| Grant date | Dec 19, 2017 |
| Priority date | — |
| Expiry date | Jan 14, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/2675
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A modular molding system having a mold base assembly for assembling an interchangeable mold insert assemblage. The assembled mold insert assemblage defines an internal cavity for forming a molded object. Each mold insert assemblage can be disengaged from the mold base assembly and exchanged with a different mold insert assemblage having an internal cavity having different dimensions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.