Manufacturing method of housing and electronic device
US9844903B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2014 |
| Grant date | Dec 19, 2017 |
| Priority date | — |
| Expiry date | Jun 11, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/757
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention discloses a method of manufacturing a housing and an electronic device. The method comprises the following steps: preparing a mold according to a predetermined shape of the housing, wherein the mold comprises at least one moving die and at least one fixed die, a first texture structure is formed on the inner surface of the mold, and the first texture structure comprises a plurality of projections arranged in a first arrangement, and a groove recesses inwardly is formed between any two adjacent projections, and the groove is formed by etching and removing a part of the moving die and/or the fixed die by the laser engraving method; closing the moving die and the fixed die, and heating the mold to a predetermined mold temperature; and injecting a raw material in a melting state into the mold cavity of the mold; retaining a pressure of the raw material in the mold cavity of the mold; cooling the mold; opening the mold to complete the housing. The housing made of the first material exhibits a second material effect in visual and/or tactile senses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.