Refractory seed metal for electroplated MEMS structures
US9845235B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2015 |
| Grant date | Dec 19, 2017 |
| Priority date | — |
| Expiry date | Sep 3, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0107
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.