Surface control additive for radiation curing system, preparation method therefor and application thereof
US9845401B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Oct 8, 2012 |
| Grant date | Dec 19, 2017 |
| Priority date | — |
| Expiry date | Oct 8, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0752
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention is related to a surface control additive for a radiation curing system, the method for its preparation as well as its application. The surface control additive has the following structure:wherein A iswherein m is an integer from 0 to 400, n is an integer from 1 to 500, x is an integer from 0 to 800, p is an integer from 0 to 600, q is an integer from 1 to 800, R4 and R5 are H or CH3 respectively, R6 is H or a linear or a branched alkyl group containing 1-18 carbon atoms or an acyl group containing 2-5 carbon atoms. The surface control additive of the present invention is applied to radiation curing (UV/EB) paint and inks, enables the coatings to maintain non-adhesive and smooth for a long time, and minimizes transferable precipitates from a cured film. In addition, by using different combinations of EO and PO, the surface control additive of the present invention can adapt to a free selection from high-polarity aquosity to a low-polarity aliphatic hydrocarbon solvent system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.