Conductive composition for thin film printing and method for forming thin film conductive pattern
US9845404B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2014 |
| Grant date | Dec 19, 2017 |
| Priority date | — |
| Expiry date | Oct 28, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0245
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided are a conductive composition for thin film printing and a method for forming a thin film conductive pattern, which can easily performing thin film printing, and can capable of improve conductivity by thermal sintering at a comparatively low temperature of 300° C. or less or by photo irradiation. A conductive composition comprises metal particles, a binder resin, and a solvent, the content of an organic compound in the solvent being 5 to 98% by mass, the organic compound comprising a hydrocarbon group having a bridged cyclic structure and a hydroxyl group, the content of metal particles being 15 to 60% by mass, the metal particles containing 20% by mass or more of flat metal particles, the content of the binder resin being 0.5 to 10 parts by mass relative to 100 parts by mass of the metal particles, and the viscosity at 25° C. being 1.0×103 to 2×105 mPa·s. The composition is printed in a pattern having any selected shape on a substrate, by screen printing, and the pattern is subjected to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.