Patent · US Active

Multilayer pressure sensitive adhesive assembly

US9845414B2 · kind B2 · utility

4Cited by

32References

14Claims

0Family size

Assignee

3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

Jan U. Wieneke · Düsseldorf, DE
Frank Kuester · Düsseldorf, DE
Zhong Chen · Woodbury, US
Jingjing Ma · Woodbury, US
Kerstin Unverhau · Neuss, DE
Doreen Eckhardt · Dormagen, DE
Claudia Torre · Düsseldorf, DE
Jonathan E. Janoski · Woodbury, US
Jayshree Seth · Woodbury, US
Arlin L. Weikel · Roberts, US

Key dates

Filing date	May 12, 2014
Grant date	Dec 19, 2017
Priority date	—
Expiry date	Aug 2, 2034

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2301/416
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The present disclosure relates to a multilayer pressure sensitive adhesive assembly comprising at least a first pressure sensitive adhesive layer superimposed to a second polymer layer, wherein a curable liquid precursor of the first pressure sensitive adhesive polymer layer comprises a low Tg (meth)acrylate copolymer and a high Tg (meth)acrylate copolymer having a weight average molecular weight (Mw) of above 20,000 Daltons. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive assembly and uses thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.