Slip and process for producing an aluminum diffusion layer
US9845526B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2013 |
| Grant date | Dec 19, 2017 |
| Priority date | — |
| Expiry date | Sep 30, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C10/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a slip for producing an aluminum diffusion layer which comprises an Al-containing powder and an Si-containing powder and a binder, the slurry further comprising an Al-containing powder the powder particles of which are coated with Si. The invention further relates to a process for producing an aluminum diffusion layer, comprising the following steps: providing a slurry according to any one of the preceding claims, applying the slurry to a component surface on which the aluminum diffusion layer is to be created, drying and/or curing by way of a heat treatment at a first temperature, and diffusion annealing at a second temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.